Printed Circuit Board (PCB) Services

At SHIMI, ensuring correctness in design and exactness of electronic specifications and performance is an obsession. Today’s system designers are faced with a number of difficult design constraints like mixed signals, high-speed design problems, numerous design reviews, costly design iterations, prototype and field failures and EMC regulations.

The designers at SHIMI understand your design concepts and transform your requirements into an optimum design that meets functional specifications with RF,SMT, BGA, Micro BGA, FPGA and high -speed analog/digital circuitry.

The design staff at SHIMI is qualified and well versed with Project Management Techniques. Further our designers communicate with customers on a daily basis and this enables the customer to plan ahead for subsequent phases of the project.

Capabilities

  • Schematic Capture and Netlist generation
  • Designs from single layer to multi-layer PCBs as per IPC / MIL STD 55110F design standards and fabrication requirements
  • Design of complex Rigid, Rigid-flex, Metal core (embedded heat sink), Thermal ladder/External heat sink (thermabonded)
  • Surface mounts, BGA, Micro BGA, Flex BGA and through-hole designs with blind and buried vias.
  • Controlled impedance traces.
  • Differential Pairs/Matched lengths.
  • High density interconnects (HDI) designs.
  • Microvias and Vialess routing.
  • Design of multi chip modules (MCMs), PC Add-on boards, burn-in boards
  • Split ground planes and power planes for mixed analog and digital designs.